Product Introduction: Semiconductor Silicon Wafer Cleaner
Designed for high-precision cleaning in semiconductor manufacturing, this specialized system combines multi-stage ultrasonic processes to meet the rigorous surface purity demands of silicon wafers, directly impacting device reliability and production yield in microelectronics fabrication.
Core Cleaning Procedures:
- Ultrasonic Alkaline Cleaning: Employs ultrasonic cavitation in alkaline media to efficiently strip organic contaminants, photoresist residuals, and particulate debris from wafer surfaces and intricate structures (e.g., trenches, vias), creating a pristine substrate for subsequent processing steps.
- Ultrasonic Acid Cleaning: Utilizes acid-based ultrasonic agitation to target and remove inorganic impurities, including metal ion contaminants (Fe, Cu, Ni) and native oxide layers, leveraging frequency-induced micro-jets to dislodge submicron particles from patterned or polished surfaces.
- Pure Water Rinsing: Final stage utilizes ultra-pure water (UPW) with resistivity ≥18.2MΩ·cm for thorough rinsing, eliminating residual cleaning agents and ensuring surface inertness—critical for post-cleaning wafer handling and thin-film deposition.
Technical Specifications:
- Ultrasonic Frequency: 40KHz-80KHz (variable frequency output, allowing optimization of cavitation intensity for different contamination profiles and wafer sizes)
- Operating Temperature: 60℃ (precision-controlled thermal environment to enhance chemical reactivity while maintaining wafer structural integrity)
- Material Construction: Tanks and contact components made from PFA and high-purity quartz to resist chemical corrosion and prevent particle shedding, ensuring zero secondary contamination.
Key Performance Advantages:
- Delivers particle removal efficiency (PRE) of ≥99.9% for particles ≥0.1μm, compliant with SEMI standards for advanced node processing
- Multi-frequency ultrasonic configuration adapts to bare wafers, epitaxial wafers, and patterned wafers (down to 7nm technology nodes)
- 60℃ temperature regulation stabilizes chemical reaction kinetics, ensuring consistent cleaning results across batch operations
- Compatible with automated wafer handling systems (SMIF pods, FOUPs) for seamless integration into fab workflows
Application Scope: Essential for pre-lithography, post-CMP (Chemical Mechanical Polishing), and pre-metallization cleaning in 6-inch to 12-inch silicon wafer production lines.
Keywords: Semiconductor wafer cleaning system, ultrasonic alkaline/acid treatment, pure water rinsing, 40-80KHz frequency, 60℃ process, silicon wafer decontamination
This system provides a reliable solution for semiconductor manufacturers seeking to minimize defect rates and enhance process stability in high-volume wafer production.
