Product Introduction: Semiconductor Silicon Wafer Cleaning System
Tailored for high-precision semiconductor manufacturing, this integrated cleaning system combines multi-stage ultrasonic processes to deliver sub-ppb level surface purity, a critical prerequisite for silicon wafer fabrication in advanced node (≤7nm) microelectronics production.
Stage-by-Stage Cleaning Mechanism:
- Ultrasonic Alkaline Cleaning: Operates at 40KHz-80KHz to generate controlled cavitation in alkaline media, efficiently stripping organic contaminants (e.g., photoresist, hydrocarbons) and particulate matter (≥1μm) from wafer surfaces and patterned structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafers, including edge bevels and backside surfaces.
- Ultrasonic Acid Cleaning: Utilizes the same frequency range in acidic solutions to target inorganic impurities—specifically metal ion contaminants (Fe, Cu, Zn) and native oxide layers (SiO₂). This stage employs cavitation-induced micro-jets to dislodge sub-100nm particles embedded in trenches or vias, validated by laser particle counters (≤5 particles/wafer for ≥0.1μm).
- Pure Water Rinse Cycle: Final rinse with UPW (ultra-pure water, TOC ≤3ppb) eliminates residual chemistries, achieving surface resistivity ≥18.2MΩ·cm to meet SEMI F020 standards for pre-deposition processing.
Technical Specifications:
- Ultrasonic Frequency Band: 40KHz-80KHz (multi-frequency selectable via PLC, optimizing cavitation intensity for contamination type)
- Process Temperature: 60℃ (PID-controlled, ±0.5℃ tolerance) to accelerate chemical reactivity without inducing wafer stress
- Material Compatibility: Wetted components in PFA and high-purity alumina to resist HF/H₂SO₄ corrosion, preventing particle shedding
Core Performance Metrics:
- Particle Removal Efficiency (PRE) ≥99.9% for ≥0.1μm contaminants
- Chemical residue elimination ≤0.1ng/cm² (ICP-MS verified)
- Compatible with automated cassette handling (FOUP/SMIF) for 24/7 fab integration
Application: Essential for pre-litho, post-CMP, and pre-implant cleaning in logic, memory, and sensor wafer production lines.
Keywords: Semiconductor wafer cleaner, ultrasonic alkaline/acid cleaning, UPW rinsing, 40-80KHz, 60℃ process, silicon wafer decontamination
This system ensures consistent cleaning performance to maximize yield in high-volume semiconductor manufacturing environments.
